P14 |
Specimen preparation in material
sciences |
|
[Friday, July 14, 09.30-12.00, Room H] |
Chair: |
A. Czyrska-Filemonowicz, Kraków; P. Barna, Budapest; |
Oral presentations: |
|
09.30-10.10 |
Recent trends and physical background in the development
and application of ion beam techniques for TEM sample preparation (invited)
A. Barna |
10.10-10.30 |
Reduction of the side-wall damage and gallium concentration
of focused ion beam prepared TEM cross sections
R.M.
Langford, A.K. Petford-Long, R. Doole |
10.30-10.50 |
Principle and application of a new high energy focused
ion gun
K. Volz,
A. Hasse, A.K. Schaper, A. Barna |
10.50-11.10 |
Preparation of TEM foils for analysis of complex inclusions
in steels
J. Walmsley,
C. van der Eijk |
11.10-11.30 |
Perpendicular cutting for cross sectional SEM specimen
preparation of layered materials by broad ion beam
R. Alani,
W. Hauffe, R.J. Mitro |
Posters: |
[Thursday, July 13, 13.30-14.50] |
P14-1 |
Improvement of quantitative X-ray spectroscopy for FIB-TEM
samples
Y. Yasufumi,
T. Okano, S. Tametou, M. Arai, T. Kouzaki |
P14-2 |
Novel approaches to the preparation of TEM samples
Q. Li,
S.B. Newcomb |
P14-3 |
Characterization of a stratified particle using a FIB/TEM
system
T. Yaguchi,
T. Kamino, H. Kobayashi, H. Koike, K. Tohji, K. Nakatsuka, R. Urao |
P14-4 |
Ion beam grid cutting (IBGC) for 3D scanning electron
microscopy of heterogeneous solids
W. Hauffe |
P14-5 |
The use of FIB in the TEM characterisation of YSZ buffer
layers
S.B. Newcomb,
W.A.J. Quinton |
P14-6 |
The TEM examination of stress corrosion cracks in Al
alloys
G. Deshais,
S.B. Newcomb |
P14-7 |
Specimen preparation for electron backscatter diffraction
(EBSD) analysis of aluminium silicon cast alloys, electro polishing versus
fast atom bombardment (FAB)
S. Gulbrandsen-Dahl,
G. Heiberg, J. Hjelen, K. Nogita, M. Raanes, A.K. Dahle, L. Arnberg |
P14-8 |
The microstructure of Si(3)N(4) prepared by ion etching
M. Gec,
K. Krnel, M. Èeh |
P14-9 |
Cross sectional preparation of microelectronic structures
with the ion milling system RES 100
W. Grünewald,
M. Hietschold |